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Awarded

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

Published

Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components. Lot 1: UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

Timeline

Publish date

10 months ago

Award date

10 months ago

Buyer information

UK Research & Innovation

Contact:
STFC Procurement
Email:
STFCProcurement@ukri.org

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