UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
Published
Description
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components. Lot 1: UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.
Timeline
Publish date
9 months ago
Award date
9 months ago
Buyer information
UK Research & Innovation
- Contact:
- STFC Procurement
- Email:
- STFCProcurement@ukri.org
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