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Awarded

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

Published

Supplier(s)

Inseto (UK) Limited

Value

250,000 GBP

Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.

Timeline

Publish date

9 months ago

Award date

9 months ago

Buyer information

UK Research & Innovation

Email:
STFCProcurement@ukri.org

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