Laserschneidanlage Stealth-Dicer
Published
Supplier(s)
Value
Description
Laserschneidanlage zur Vereinzelung von Silizium-Substraten mittels Stealth Dicing Lot 1: Laserschneidanlage zur Vereinzelung von Silizium-Substraten mittels Stealth Dicing
Timeline
Publish date
2 years ago
Award date
2 years ago
Buyer information
Hahn-Schickard-Gesellschaft für angewandte Forschung e. V.
- Contact:
- Herr Markus Nagler
- Email:
- markus.nagler@hahn-schickard.de
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