Awarded contract

Published 2 years ago

Individueller Flip Chip Verbindungsprozess

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Buyer

Universität Stuttgart

Description

Personalised AI Summary

Product / service

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Contract structure

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Organisation mentioned

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Supplier requirements

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CPV Codes

31712110 - Electronic integrated circuits and microassemblies

31712118 - Integrated circuit sockets or mounts

31712117 - Integrated circuit packages

31712116 - Microprocessors

31712115 - Microassemblies

31712114 - Integrated electronic circuits

31712113 - Cards containing integrated circuits

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