UKRI-1308 DUNE APA Printed Circuit Boards

Description

This PIN is to advise the market of UKRI's current intentions regarding the procurement of Printed Circuit Boards (PCBs). Printed Circuit Boards (PCBs) are needed to construct charge readout anode plane assemblies (APAs) for the Deep Underground Neutrino Experiment based at Sanford Underground Research Facility in South Dakota. Each of these PCBs are required to operate reliably in (Liquid Argon) LAr over many years (>20 years) so Quality Assurance is a critical element to this project. A key requirement for these PCBs are the mechanical tolerances. As described below, board thickness must be maintained to ±5%, and machining of features on the board is required to a high tolerance. Lot 1: The fabrication of 41,952 PCBs is required to produce 132 APAs + ~15%. Drawings and order quantities are provided in the Delta esourcing portal. The main specifications are: a)Thickness of each board must not exceed +/-5% of the total thickness specified in the drawings. b)Tolerances for Depth milling, Edge milling, Counterbore holes and Countersink holes are critical and should be adhered to. A critical aspect for the milling is that tongues on the edges of some boards must be controlled to a tolerance of ±0.1 mm. c) A summary of the tolerances that must be achieved are as follows: Board thickness: +/- 5% Tongue dimensions: +/- 0.10 mm Glue grooves: +/-0.20 mm Board positioning holes: +/- 0.15 mm All other board features: +/- 0.40 mm d) Size of plated through holes for insertion of Mill-Max contacts described in the Delta esourcing portal is 1.47+/-0.025. e) The PCBs will be produced in batches over a period of 65 months. Additional information: UKRI intend to hold a virtual market engagement event in week commencing 19th July 2021. This event will provide potential bidders with an opportunity to find out more about the requirement as well as raise questions and provide valuable feedback. Please refer to the additional information field for details on how to express an interest and information regarding the Market Engagement Event.