Magnetron Sputter Deposition Tool

Description

Argon-based magnetron sputtering system for sequential deposition of metals. The deposition should be made with a direct current method over up to 4” wafer area. The deposition should also be conformal to features present on the wafers. The ideal system will be employed for academic research and located within a cleanroom micro-fabrication facility. Lot 1: The Institute of Photonics is seeking to complement their cleanroom micro-fabrication facility equipment with a metal deposition tool for contacting semiconductor light-emitting devices based on Gallium Nitride, for example but not limited to. The system is primarily destined to be employed for academic research. It is purposed to be a downgrade from existing industrial-scale legacy equipment. The system sought after is destined to provide the capability for sequential deposition of at least 3 metal targets, containing namely Titanium, Gold and Aluminium in a direct current (DC) mode only. The targets should be of small size, ideally with a 2” diameter range. The system should do the deposition within an Argon environment with sample rotation. Thickness deposition monitor is not compulsory but would be considered favourably. Similarly, substrate heating would be considered as a positive option for the system. The sample loaded can be as small as a single 4” wafer. An important parameter of the deposition is the complete conformal coating capability of micron-scale patterns of at least 10 µm lateral sizes and step height of at least 5 µm.. The University is publishing this PIN for initial Market Research and Engagement purposes. The University may conduct further market engagement with the suppliers that note interest in this opportunity.