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Openclosing

LA2977C- UCC- RFT for the Supply of a High Precision Wafer Grinding System

Published

Value

240,000 EUR

Description

University College Cork request the supply of a High Precision Wafer Grinding System. The planned system will be capable of handling wafers of up to 200mm (8-inches) in diameter and will be capable of processing wide variety of materials (silicon, compound semiconductors, glass, ceramics, sapphire, etc.). The desired system will be fully automatic and will carry out the wafer grinder operation in an enclosed chamber. It is envisaged that it will be a single-spindle system suited to research-scale and prototyping volumes. University College Cork request the supply of a High Precision Wafer Grinding System. The planned system will be capable of handling wafers of up to 200mm (8-inches) in diameter and will be capable of processing wide variety of materials (silicon, compound semiconductors, glass, ceramics, sapphire, etc.). The desired system will be fully automatic and will carry out the wafer grinder operation in an enclosed chamber. It is envisaged that it will be a single-spindle system suited to research-scale and prototyping volumes.

Timeline

Publish date

17 days ago

Close date

in 11 days

Buyer information

Education Procurement Service (EPS)

Contact:
Education Procurement Service (EPS)
Email:
info@educationprocurementservice.ie

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Notice topic

Laboratory, optical and precision equipments (excl. glasses)

Related topics

Miscellaneous evaluation or testing instrumentsIndustrial process control equipment and remote-control equipmentTime registers and the like; parking metersOptical instrumentsChecking and testing apparatusInstruments for checking physical characteristics

Source

eTenders Ireland
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